Wafer Fab Boom: How Wide Is the Gap in Local Semiconductor Pneumatic Components?

June 29, 2026

As domestic 12-inch wafer production lines enter a dense commissioning period, high-end pneumatic components for semiconductor manufacturing are facing explosive demand and have become a core battlefield for localization breakthroughs. Industry data shows that China’s semiconductor pneumatic valve market is expected to reach 5.61 billion yuan in 2026, up 18.7% year-on-year, maintaining a strong growth momentum. In mature process nodes, domestic substitution has entered the mass adoption stage, but the technological gap in advanced processes remains clear.

Wafer Fab Boom: How Wide Is the Gap in Local Semiconductor Pneumatic Components?


The progress of substitution shows obvious differentiation. In wet cleaning and chemical delivery links of 28nm and above mature process lines, domestic pneumatic six-way valves account for 41.2% of installed capacity. The overall localization rate of ultra-high vacuum pneumatic valves in mature processes has exceeded 50%, with leakage rates of leading domestic products reaching 10⁻⁹ Pa·m³/s, basically matching international standards. Domestic equipment manufacturers have raised the valve localization target for new models to over 65%, and the demand for supply chain autonomy continues to push domestic components to accelerate verification and adoption.

Wafer Fab Boom: How Wide Is the Gap in Local Semiconductor Pneumatic Components?


However, gaps cannot be ignored. In advanced processes of 14nm and below, the localization rate of core process pneumatic components is only about 22%, and key categories such as ultra-high vacuum metal-sealed valves and high-purity corrosion-resistant process valves still rely heavily on imports. There are structural shortages in core upstream materials such as perfluoroether rubber and special alloys. Gaps still exist in long-term product stability and cleanliness consistency compared with international brands. Coupled with barriers such as SEMI certification and long production line verification cycles, full substitution will still take time. Between the huge market space brought by capacity expansion and the deep-water technical barriers, the localization breakthrough of semiconductor pneumatic components is in a critical climbing period from “usable” to “reliable”.
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